march 2010 doc id 14730 rev 2 1/7 7 EMIF06-1002F2 6-line ipad?, emi filter and esd protection features lead-free package very low pcb space consumption 1.92 mm x 1.79 mm very thin package: 0.65 mm high efficiency in esd suppression (iec 61000-4-2 level 4 on external pins) high reliability offered by monolithic integration high reduction of parasitic elements through integration and wafer level packaging complies with the following standards iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) application this device is designed for emi filtering in esd sensitive equipment such as mobile phones. description the EMIF06-1002F2 is a highly integrated device designed to suppress emi/rfi noise in all systems subjected to electromagnetic interference. the EMIF06-1002F2 flip chip packaging means the package size is equal to the die size. this filter includes an esd protection circuitry which prevents damage to the application when subjected to esd surges up 15 kv. this device includes 6 emi filters. tm : ipad is a trademark of stmicroelectronics. figure 1. pin configuration (bump side) figure 2. basic cell configuration flip chip (14 bumps) 43 2 1 a b c e g d f 43 2 1 a i2 o2 i1 o1 i3 o3 i4 o4 i5 o5 i6 o6 gnd gnd b c e g d f external pin internal pin external pin internal pin www.st.com
electrical characteristics EMIF06-1002F2 2/7 doc id 14730 rev 2 1 electrical characteristics table 1. absolute maximum ratings (1) 1. (tamb = 25 c) symbol parameter value unit v pp esd discharge iec 61000-4-2, level 4 on external pins (i1 to i6) air discharge contact discharge air discharge on internal pins (o1 to o6) contact discharge on internal pins (o1 to o6) 15 8 2 2 kv t j junction temperature range -30 to 125 c t stg storage temperature range -55 to 150 c table 2. electrical characteristics (1) 1. (tamb = 25 c) symbol parameters v br breakdown voltage i rm leakage current @ v rm v rm stand-off voltage v cl clamping voltage r d dynamic impedance i pp peak pulse current r i/o series resistance between input and output c line input capacitance per line symbol test conditions min typ max unit v br i r = 1 ma 6 v i rm v rm = 3 v 200 na r i/o 80 100 120 c line v r = 3 v dc, f = 1 mhz 9.2 11.5 13.8 pf f c cut-off frequency (z source = z load = 50 ) 280 mhz i v i f v f i rm i r i pp v rm v br v cl
EMIF06-1002F2 electrical characteristics doc id 14730 rev 2 3/7 figure 7. line capacitance versus applied voltage for filter figure 3. s21 attenuation measurements figure 4. analog crosstalk measurements 100.0k 1.0m 10.0m 100.0m 1.0g - 40.00 - 35.00 - 30.00 - 25.00 - 20.00 - 15.00 - 10.00 - 5.00 0.00 i1 - o1 i2 - o2 i3 - o3 i4 - o4 i5 - o5 i6 - o6 f (hz) db 100.0k 1.0m 10.0m 100.0m 1.0g - 140.00 - 130.00 - 120.00 - 110.00 - 100.00 - 90.00 - 80.00 - 70.00 - 60.00 - 50.00 - 40.00 - 30.00 - 20.00 - 10.00 0.00 i1 - o2 i1 - o6 f (hz) db figure 5. esd response to iec61000-4-2 (+ 15 kv air discharge) on one input (v in ) and one output (v out ) figure 6. esd response to iec61000-4-2 (- 15 kv air discharge) on one input (v in ) and one output (v out ) c(pf) 0 2 4 6 8 10 12 14 16 18 012345 v (v) line f=1mhz v osc =30mv rms t j =25c
ordering information scheme EMIF06-1002F2 4/7 doc id 14730 rev 2 2 ordering information scheme figure 8. ordering information scheme emif yy - xxx z fx emi filter number of lines information package x = resistance value (ohms) z = capacitance value / 10(pf) f = flip chip x = 2: lead-free, pitch = 500 m, bump = 315 m
EMIF06-1002F2 package information doc id 14730 rev 2 5/7 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 9. package dimensions note: more packing information is av ailable in the application notes: an1235: "flip chip: package description and recommendations for use" an1751: ?emi filters: recommendations and measurements? figure 10. footprint figure 11. marking 1.79 mm 50 m 1.92 mm 50 m 315 m 50 500 m 10 500 m 10 650 m 65 copper pad diameter: 250 m recommended , 300 m max solder stencil opening: 330 m solder mask opening recommendation: 340 m min for 300 m copper pad diameter x y z w x w dot, st logo xx = marking yww = datecode (y = year ww = week) z = manufacturing location e
ordering information EMIF06-1002F2 6/7 doc id 14730 rev 2 figure 12. flip chip tape and reel specification 4 ordering information 5 revision history dot identifying pin a1 location user direction of unreeling all dimensions in mm 4 0.1 8 0.3 4 0.1 1.75 0.1 3.5 0.1 ? 1.5 0.1 0.73 0.05 xxz yww xxz yww st e 2.02 1.89 xxz yww xxz yww st e xxz yww xxz yww st e table 3. ordering information order code marking package weight base qty delivery mode EMIF06-1002F2 jc flip chip 4.7 mg 5000 tape and reel 7? table 4. document revision history date revision changes 21-may-2008 1 first issue. 29-mar-2010 2 upated flip chip tape and reel specification figure 12.
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